Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
1998-06-26
2001-08-14
Ball, Michael W. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S273500, C156S275500, C156S275700, C430S286100, C522S135000, C522S172000
Reexamination Certificate
active
06273985
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention is directed to a process for bonding articles of specific polymers to other articles with an adhesion promoter. More specifically, the present invention is directed to a process for bonding an article comprising a polymer having photosensitivity-imparting substituents to a second article comprising metal, silicon, plasma nitride, or glass with an adhesion promoter which is a titanium, zirconium, or silicon compound. One embodiment of the present invention is directed to a process for bonding a first article to a second article which comprises (a) providing a first article comprising a polymer having photosensitivity-imparting substituents; (b) providing a second article comprising metal, plasma nitride, silicon, or glass; (c) applying to at least one of the first article and the second article an adhesion promoter selected from silanes, titanates, or zirconates having (i) alkoxy, aryloxy, or arylalkyloxy functional groups and (ii) functional groups including at least one photosensitive aliphatic >C═C< linkage; (d) placing the first article in contact with the second article; and (e) exposing the first article, second article, and adhesion promoter to radiation, thereby bonding the first article to the second article with the adhesion promoter. Another embodiment of the present invention is directed to an ink jet printhead which comprises (i) an upper substrate with a set of parallel grooves for subsequent use as ink channels and a recess for subsequent use as a manifold, the grooves being open at one end for serving as droplet emitting nozzles, (ii) a lower substrate in which one surface thereof has an array of heating elements and addressing electrodes formed thereon, at least a portion of said surface comprising metal, plasma nitride, silicon, or glass, and (iii) an insulative layer deposited on the surface of the lower substrate and over the heating elements and addressing electrodes and patterned to form recesses therethrough to expose the heating elements and terminal ends of the addressing electrodes, the upper and lower substrates being aligned, mated, and bonded together to form the printhead with the grooves in the upper substrate being aligned with the heating elements in the lower substrate to form droplet emitting nozzles, said insulative layer comprising a crosslinked or chain extended polymer wherein the crosslinking or chain extension is at least partly through photosensitivity-imparting substituents; said insulative layer being bonded to the surface of the lower substrate with an adhesion promoter selected from silanes, titanates, or zirconates having (a) alkoxy, aryloxy, or arylalkyloxy functional groups and (b) functional groups including at least one photosensitive aliphatic >C═C< linkage. Yet another embodiment of the present invention is directed to a process for forming an ink jet printhead which comprises (a) providing a lower substrate in which one surface thereof has an array of heating elements and addressing electrodes having terminal ends formed thereon, at least a portion of said surface comprising metal, plasma nitride, silicon, or glass; (b) depositing onto the surface of the lower substrate having the heating elements and addressing electrodes thereon an adhesion promoter selected from silanes, titanates, or zirconates having (i) alkoxy, aryloxy, or arylalkyloxy functional groups and (ii) functional groups including at least one photosensitive aliphatic >C═C< linkage; (c) depositing onto the surface of the lower substrate having the adhesion promoter thereon an insulative layer comprising a polymer having photosensitivity-imparting substituents, provided that the R
2
group of the adhesion promoter contains a functional group which is capable of reacting with the material selected for the insulative layer; (d) exposing the adhesion promoter and the insulative layer to actinic radiation in an imagewise pattern such that the polymer comprising the insulative layer in exposed areas becomes crosslinked or chain extended and the polymer in unexposed areas does not become crosslinked or chain extended, wherein the unexposed areas correspond to areas of the lower substrate having thereon the heating elements and the terminal ends of the addressing electrodes, and wherein the insulative layer is bonded to the lower substrate with the adhesion promoter in exposed areas; (e) removing the adhesion promoter and the polymer from the unexposed areas, thereby forming recesses in the layer, said recesses exposing the heating elements and the terminal ends of the addressing electrodes; (f) providing an upper substrate with a set of parallel grooves for subsequent use as ink channels and a recess for subsequent use as a manifold, the grooves being open at one end for serving as droplet emitting nozzles; and (g) aligning, mating, and bonding the upper and lower substrates together to form a printhead with the grooves in the upper substrate being aligned with the heating elements in the lower substrate to form droplet emitting nozzles, thereby forming a thermal ink jet printhead. Still another embodiment of the present invention is directed to an ink jet printhead which comprises (i) an upper substrate with a set of parallel grooves for subsequent use as ink channels and a recess for subsequent use as a manifold, the grooves being open at one end for serving as droplet emitting nozzles, (ii) a lower substrate in which one surface thereof has an array of heating elements and addressing electrodes formed thereon, at least a portion of said surface comprising metal, plasma nitride, silicon, or glass, and (iii) an insulative layer deposited on the surface of the lower substrate and over the heating elements and addressing electrodes and patterned to form recesses therethrough to expose the heating elements and terminal ends of the addressing electrodes, the upper and lower substrates being aligned, mated, and bonded together to form the printhead with the grooves in the upper substrate being aligned with the heating elements in the lower substrate to form droplet emitting nozzles, said insulative layer comprising (a) a crosslinked or chain extended polymer wherein the crosslinking or chain extension is at least partly through photosensitivity-imparting substituents, and (b) an adhesion promoter selected from silanes, titanates, or zirconates having (1) alkoxy, aryloxy, or arylalkyloxy functional groups and (2) functional groups including at least one photosensitive aliphatic >C═C< linkage. Another embodiment of the present invention is directed to a process for forming an ink jet printhead which comprises (a) providing a lower substrate in which one surface thereof has an array of heating elements and addressing electrodes having terminal ends formed thereon, at least a portion of said surface comprising metal, plasma nitride, silicon, or glass; (b) depositing onto the surface of the lower substrate an insulative layer comprising (i) a polymer having photosensitivity-imparting substituents, and (ii) an adhesion promoter selected from silanes, titanates, or zirconates having (A) alkoxy, aryloxy, or arylalkyloxy functional groups and (B) functional groups including at least one photosensitive aliphatic >C═C< linkage; (c) exposing the insulative layer to actinic radiation in an imagewise pattern such that the polymer comprising the insulative layer in exposed areas becomes crosslinked or chain extended and the polymer in unexposed areas does not become crosslinked or chain extended, wherein the unexposed areas correspond to areas of the lower substrate having thereon the heating elements and the terminal ends of the addressing electrodes, and wherein the insulative layer is bonded to the lower substrate in exposed areas; (d) removing the adhesion promoter and the polymer from the unexposed areas, thereby forming recesses in the layer, said recesses exposing the heating elements and the terminal ends of the addressing electrodes; (e) providing an upper substrate with a
DeLouise Lisa A.
Luca David J.
Ball Michael W.
Byorick Judith L.
Tolin Michael A.
Xerox Corporation
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