Bonding pattern discrimination program

Details Bonding pattern discrimination program Bonding pattern discrimination program

2008-01-22

2008-01-22

Desire, Gregory M (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C156S351000, C156S358000, C228S103000, C324S765010, C382S218000, C382S294000

Reexamination Certificate

active

07321681

ABSTRACT:
Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

REFERENCES:
patent: 4958762 (1990-09-01), Shimizu et al.
patent: 5901241 (1999-05-01), Koljonen et al.
patent: 6016358 (2000-01-01), Balamurugan
patent: 6381359 (2002-04-01), Hayata
patent: 6917699 (2005-07-01), Sugawara
patent: 7224829 (2007-05-01), Enokido
patent: 2007/0036423 (2007-02-01), Enokido
patent: 2007/0036424 (2007-02-01), Enokido
patent: 2007/0036425 (2007-02-01), Enokido et al.
patent: 2007/0041632 (2007-02-01), Enokido et al.
patent: 63-56764 (1988-03-01), None
patent: 2864735 (1999-03-01), None
patent: 2002-208010 (2002-07-01), None

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