Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-05-01
2007-05-01
Dinh, Tuan (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S254000, C174S250000, C174S257000, C174S259000, C174S266000, C361S748000, C361S749000, C361S750000, C361S767000, C361S760000, C257S664000, C257S665000, C257S734000
Reexamination Certificate
active
10891921
ABSTRACT:
A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a second conductive layer is formed overlying the protection layer. An opening structure penetrates the second conductive layer and the protection layer to expose the first conductive layer. A third conductive layer is formed overlying the second conductive layer to contact the sidewall and bottom of the opening structure. Thus, the third conductive layer is electrically connected to the second conductive layer to provide a first electrical-connection path, and the third conductive layer is electrically connected to the first conductive layer to provide a second electrical-connection path.
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Chen Hui-Chang
Chou Shy-Ping
Lee Chun-Yu
AU Optronics Corp.
Dinh Tuan
Nguyen Hoa C.
Thomas Kayden Horstemeyer & Risley
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