Bonding pad structure and method thereof

Details Bonding pad structure and method thereof Bonding pad structure and method thereof

1995-10-27

1998-01-13

Picardat, Kevin

Fishing, trapping, and vermin destroying

437190, 437192, H01L 2160

Patent

active

057078947

ABSTRACT:
A structure and a process for forming an improved bonding pad which resists bond pad peeling of between the bonding pad layer and the underlying layers. The method comprises forming plurality of anchor pads on said substrate surface in a bonding pad area. Next, a first insulating layer is formed over said substrate surface and the anchor pads. Vias are formed through the first insulating layer. The vias are filled with a second metal layer making a connection to the anchor pads and the first insulating layer is covered in the bonding pad area with the second metal layer. It is important that the via holes have a smaller cross sectional area than the anchor pads so that the combination of the anchor pads and the second metal form small "hooks" into the first insulating layer that hold the second metal (bonding pad layer) to the underlying layer.

REFERENCES:
patent: 4600658 (1986-07-01), Anderson et al.
patent: 4800177 (1989-01-01), Nakamae
patent: 5057447 (1991-10-01), Paterson
patent: 5309025 (1994-05-01), Bryant et al.
patent: 5476817 (1995-12-01), Numata
patent: 5488013 (1996-01-01), Geffken et al.
patent: 5534462 (1996-07-01), Fiordalice et al.

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