Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2005-04-05
2005-04-05
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C228S246000, C360S234500, C360S264200
Reexamination Certificate
active
06874677
ABSTRACT:
A new type of suspension circuit electrical bonding pad for electrically and mechanically connecting the magnetic recording head is described. The new type of bonding pad will serve as the joint material as well as the joint interface. Thus, there is no need to apply the conductive material in between the bonding pads and the magnetic recording head terminals, consequently reducing the process leading time and simplifying the magnetic recording head assembly process.
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Tao Rock
Wong Xm
Edmondson Lynne R.
SAE Magnetics (H.K. ) Ltd.
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