Bonding pad for semiconductor devices

Details Bonding pad for semiconductor devices Bonding pad for semiconductor devices

1990-11-15

1991-10-01

James, Andrew J.

357 65, H01L 3300

Patent

active

050538500

ABSTRACT:
A bonding pad is described having a reduced surface area while maintaining adequate wire bonding surface. The bonding pad comprises: a test pad for contacting with a test probe; a plurality of radially extending conductive fingers; and an alignment key generally in the form of a circle disposed about a portion of the fingers.

REFERENCES:
patent: 4864370 (1989-09-01), Gaw et al.

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