Bonding pad for preventing pad peeling

Details Bonding pad for preventing pad peeling Bonding pad for preventing pad peeling

2011-08-02

2011-08-02

Le, Thao (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257SE21122, C257SE23020

Reexamination Certificate

active

07989962

ABSTRACT:
A bonding pad includes multiple metal layers, insulation layers disposed between the multiple metal layers, and a fixing pin coupled between the uppermost metal layer and an underlying metal layer of the multiple metal layers, where a bonding is performed on the uppermost metal layers.

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