Bonding pad for contacting a device

Details Bonding pad for contacting a device Bonding pad for contacting a device

2007-09-12

2010-10-19

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S786000, C257SE23020

Reexamination Certificate

active

07816791

ABSTRACT:
A bonding pad on a substrate has a first metal structure establishing an electrical connection between a device and a bonding area, and a second metal structure arranged at the bonding area. The first metal structure extends, within the bonding area, at least over part of the bonding area between the substrate and the second metal structure, so as to contact the second metal structure, the second metal structure being harder than the first metal structure.

REFERENCES:
patent: 4087314 (1978-05-01), George et al.
patent: 5149674 (1992-09-01), Freeman et al.
patent: 5502337 (1996-03-01), Nozaki
patent: 5886762 (1999-03-01), Lee et al.
patent: 6313537 (2001-11-01), Lee et al.
patent: 6960836 (2005-11-01), Bachman et al.
patent: 2003/0141593 (2003-07-01), Zuniga-Ortiz et al.
patent: 2004/0135267 (2004-07-01), Akiyama
patent: 2005/0001324 (2005-01-01), Dunn et al.
patent: 2006/0071336 (2006-04-01), Akram
patent: 2006/0091536 (2006-05-01), Huang et al.
patent: 2406707 (2005-04-01), None
patent: 03075340 (2003-09-01), None

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