Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...
Reexamination Certificate
2007-10-09
2007-10-09
Ha, Nathan W. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Non-single crystal, or recrystallized, semiconductor...
Field effect device in non-single crystal, or...
Reexamination Certificate
active
10434078
ABSTRACT:
A bonding pad structure on marginal area of a substrate of a liquid crystal display comprises a plurality of bonding pads and insulations. The bonding pads defined at the time of forming a gate on pixel area of the substrate are located on marginal area of the substrate, whereas the insulations defined at the time of forming a dielectric layer to cover the gate are sandwiched between the bonding pads.
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AU Optronics Corp.
Ha Nathan W.
Troxell Law Office PLLC
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