Bonding of thermoset composite structures

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156148, 156182, 1562739, 156276, 1563066, 1563073, 1563082, 156344, B32B 3100

Patent

active

053042697

ABSTRACT:
A pair of thermoset composite structures (19,19') are bonded together by a pair of adhesive strips (10,10'). An adhesive strip (10) is comprised of a layer of semi-crystalline thermoplastic material (12), a layer of amorphous thermoplastic material (14), a layer of dry fiber reinforcement (16) partially embedded in the layer of amorphous thermoplastic material (14), and a layer of thermosetting resin (18) covering the exposed fibers of the dry fiber reinforcement. An adhesive strip is bonded to the bonding surface (20) of the structure (19) during the curing process for the thermoset composite structure. A resistance heating element is placed between the bonding surfaces (20,20'), the bonding surfaces (20,20') are pressed together, and electrical energy is passed through the heating element (24) to heat the joint and fuse the thermoplastic adhesive layers together. The dry fiber reinforcement (16) forms a mechanical lock between the cumulative layer of thermoplastic adhesive (32) and the thermosetting structures (19,19') to provide the bond strength.

REFERENCES:
patent: 2372929 (1945-04-01), Blessing
patent: 2715598 (1955-08-01), Rees et al.
patent: 2952578 (1960-09-01), Carlson, Jr.
patent: 3239403 (1966-03-01), Williams et al.
patent: 3864186 (1974-02-01), Balla
patent: 3868291 (1975-02-01), Benz et al.
patent: 3900360 (1975-08-01), Leatherman
patent: 3985604 (1976-10-01), Balla
patent: 3993529 (1976-11-01), Farkas
patent: 3996402 (1976-12-01), Sindt
patent: 4045272 (1977-08-01), Lombardi
patent: 4110506 (1978-08-01), Cottingham et al.
patent: 4268338 (1981-05-01), Peterson
patent: 4313777 (1982-02-01), Buckley et al.
patent: 4416713 (1983-11-01), Brooks
patent: 4533589 (1985-08-01), Sewell
patent: 4556439 (1985-12-01), Bannick et al.
patent: 4560428 (1985-12-01), Sherrick et al.
patent: 4704509 (1987-11-01), Hilmersson et al.
patent: 4908088 (1990-03-01), Boyd et al.
patent: 4957805 (1990-09-01), Biggs et al.
patent: 4963215 (1990-10-01), Ayers

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