Bonding of thermoplastic sheet material to roughened substrates

Details Bonding of thermoplastic sheet material to roughened substrates Bonding of thermoplastic sheet material to roughened substrates

1990-05-30

1992-05-19

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156212, 156285, 428 40, 428409, B32B 3100, B32B 3112, B29C 6500

Patent

active

051145146

ABSTRACT:
A protective and decorative sheet material, such as a paint-coated film, which is bonded by an adhesive layer and vacuum thermoforming to a substrate, can develop surface roughness when exposed to heat for extended periods of time. This defect is unexpectedly reduced or eliminated by raising the surface energy of the substrate and roughening the surface of the substrate within certain limits, prior to application of the sheet material.

REFERENCES:
patent: 3193424 (1965-02-01), Scott
patent: 3449176 (1969-06-01), Klass et al.
patent: 3551232 (1970-12-01), Thompson
patent: 4321307 (1982-03-01), Bragole et al.
patent: 4769100 (1988-09-01), Short et al.
patent: 4778548 (1988-10-01), Fox et al.
patent: 4798772 (1989-01-01), Furakawa
patent: 4824506 (1989-04-01), Hoerner et al.
patent: 4828637 (1989-05-01), Mentzer et al.
patent: 4861407 (1989-08-01), Volkmann et al.
patent: 4936936 (1990-06-01), Rohrbacher
patent: 5026448 (1991-06-01), Reafler et al.
patent: 5034269 (1991-07-01), Wheeler
Barrett et al., The Principles of Engineering Materials: Englewood Cliffs, N.J., Prentice-Hall, Inc., 1973, p. 86.

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