Bonding of structures

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

28100, 156166, 156306, 428288, 428296, 428373, B32B 3120

Patent

active

040352196

ABSTRACT:
A non-woven structure, method and apparatus for producing non-wovens; the structure having 1) between about 50 and 1000 bond points per square inch, 2) bond points with a cross sectional area of from about 1 .times. 10.sup.-.sup.5 sq. ins. to about 1 .times. 10.sup.-.sup.3 sq. ins. and 3) a bonded area of from about 1% to 20% of the total area; the process comprising forming a non-woven structure which is then passed through a pressure nip comprising a bonding member and a backing member.

REFERENCES:
patent: 3912567 (1975-10-01), Schwartz
patent: 3920874 (1975-11-01), Dempsey et al.

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