Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1990-10-09
1993-03-09
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174259, 228208, 228 563, H05K 100
Patent
active
051928353
ABSTRACT:
The present invention relates to a solid state assembly having a solid state device bonded to a terminal board of an insulating material having a plurality of metal terminal pads thereon and arranged in a pattern. A metal bump is on each of the terminal pads of the terminal plate with an amalgam layer covering at least a top of each bump. The solid state device has a plurality of metal terminal pads thereon. The solid state device is mounted on the terminal board with each of its terminal pads being seated on the amalgam of each bump on the terminal board. The assembly is formed by placing some amalgam on each of the bumps on the terminal plate. The solid state device is then mounted on the terminal plate and the amalgam is hardened, such as by heating at a low temperature, to bond the amalgam to the bumps and the solid state device terminal plates. Once the device is bonded to the terminal board, the temperature the assembly is subject to can be higher than the temperature used for the bonding operation without causing any harm to the bond.
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Bardy, George S. and Henry R. Clauser, Material Handbook, Eleventh Edition, McGraw-Hill Book Comp., N.Y., 1977, p. 48.
Abstract-C. A. MacKay, International Electronic Packaging Conf., San Diego, Calif., Sep. 11-13, 1989, published in the Conference Proceedings, pp. 1244-1259, Int. Electronic Packaging Society, 1989.
Bull David N.
Ozimek Edward J.
Tarn Terry
Eastman Kodak Company
Kaufman Stephen C.
Korka Trinidad
Picard Leo P.
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