Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming nonelectrolytic coating after depositing...
Patent
1991-11-08
1993-06-08
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Forming nonelectrolytic coating after depositing...
205263, 205264, 205265, 205267, 205277, 205290, 205297, C25D 548, C25D 500, C25D 312, C25D 338
Patent
active
052175995
ABSTRACT:
Disclosed is a method for electroplating a metal sheet adapted for being used in electronic packaging material, such as printed circuit boards. Bismaleimide and its derivative are added into the plated solution so as to form insoluble particles of bismaleimide and its derivatives on the surface of the metal sheet. The resulting metal sheet is particularly adapted for being bonded to a polyimide film for the preparation of, for example, a printed circuit board. Also disclosed is a method of bonding the metal sheet of the present invention to a polyimide substrate. Precursor of polyimide are coated on the surface of the plate metal sheet and then thermal imidizing of the precursors takes place. No additional adhesives are needed for this bonding.
REFERENCES:
patent: 4246077 (1981-01-01), Hradil et al.
patent: 4406755 (1983-09-01), Morrissey
Chen Ker-Ming
Cheng Richard P.
Ho Syh-Ming
Hung Aina
Wang Tsung-Hsiung
Industrial Technology Research Institute
Niebling John
Starsiak Jr. John S.
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