Bonding of organic thermoplastic materials

Details Bonding of organic thermoplastic materials Bonding of organic thermoplastic materials

1975-02-07

1977-05-10

Drummond, Douglas J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156306, B29C 1904

Patent

active

040226484

ABSTRACT:
An organic thermoplastic resin having dielectric properties is bonded to a substrate material by heating the plastic, bringing it into contact with the substrate, and applying an electric potential therethrough so as to join the plastic and the substrate together. The substrate material may be an electrical conductor such as a metal sheet or foil, or it may be a plastic of similar or dissimilar chemical composition or a glass or other dielectric.

REFERENCES:
patent: 2706165 (1955-04-01), Korsgaard
patent: 3589965 (1971-06-01), Wallis et al.
patent: 3647592 (1972-03-01), Woodberry
patent: 3755043 (1973-08-01), Igarashi et al.

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