Bonding of micro elements

Details Bonding of micro elements Bonding of micro elements

1998-09-14

2000-07-11

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562742, 1562757, 29832, 257783, B32B 3124, H05K 330

Patent

active

060867051

ABSTRACT:
A novel method for bonding of micro elements with in-situ bonding means is disclosed. Suited bonding means include heating coils and bonding materials. The bonding means are provided in the elements to be bonded during their preparation. While the elements are bonded, electric power is applied to the heating coil such that the bonding material is melt and that the elements are bonded. An elastic calibration means is provided in at least one of the elements to be bonded such that the distance and parallelism of the elements may be calibrated during the bonding process.

REFERENCES:
patent: H000629 (1989-04-01), Murdoch
patent: 4184043 (1980-01-01), Hildering
patent: 4506139 (1985-03-01), Daughton
patent: 5624750 (1997-04-01), Martinez et al.
patent: 5951893 (1999-09-01), Bitko et al.

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