Bonding of leads

Details Bonding of leads Bonding of leads

1974-12-23

1977-01-25

Smith, Al Lawrence

Metal fusion bonding

Process

With shaping

228179, 228180A, 174 685, H05K 110, H05K 332

Patent

active

040047261

ABSTRACT:
Leads are bonded to a substrate by interposing between the substrate and the leads a conductor portion having substantially the same thickness as the thickness of the leads. In the preferred embodiment, the conductor portion is an end portion of the lead which is folded back on the lead and which is brought into contact with the substrate for bonding.

REFERENCES:
patent: 973586 (1910-10-01), Thomson
patent: 1125070 (1915-01-01), Daviee
patent: 1682403 (1928-08-01), Murray
patent: 3380155 (1968-04-01), Burks
patent: 3403438 (1968-10-01), Best et al.
patent: 3588618 (1971-06-01), Otte
patent: 3590056 (1971-08-01), Clark
Western Electric Technical Digest, No. 38, Apr. 1975, pp. 13-14.

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