Bonding of ferrite to metal for high-power microwave application

Details Bonding of ferrite to metal for high-power microwave application Bonding of ferrite to metal for high-power microwave application

1974-10-08

1976-02-24

Smith, Al Lawrence

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

B23K 120

Patent

active

039400514

ABSTRACT:
A ferrite-to-metal bond suitable for the environment of a high-power microwave circulator is disclosed. The bonding surface of a gyromagnetic ferrite or garnet button is metallized by a sputtering process that deposits successive layers of nichrome, copper and gold thereon. During the sputtering process, a flexible stainless steel band surrounds the button to prevent sputtered material from being deposited on other than the bonding surface of the button. The metallized bonding surface is then soldered to a metal wall of the circulator. The bond so formed is capable of withstanding a peak power level in the circulator of 2.0 megawatts and an average power level of 3.5 kilowatts under standing-wave conditions.

REFERENCES:
patent: 3372471 (1968-03-01), Kuhn

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