Bonding of dissimilar workpieces to a substrate

Details Bonding of dissimilar workpieces to a substrate Bonding of dissimilar workpieces to a substrate

1974-07-15

1976-06-15

Wolciechowicz, Edward J.

357 69, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

039640930

ABSTRACT:
Device leads are compliantly bonded and external leads are directly bonded to a substrate with a single stroke of a bonding tool. The external leads are comprised in a lead frame that includes a compliant medium portion for bonding the device leads.

REFERENCES:
patent: 3778887 (1973-12-01), Suzuki et al.

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