Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1989-05-23
1992-03-24
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
264 56, 264 58, 428210, 428325, 428384, 428701, 428702, B32B 1800
Patent
active
050984942
ABSTRACT:
Ceramic parts may be bonded by forming bonding layers of silicon dioxide, silicon, metal or metal oxide on the parts, placing the bonding layers adjacent one another and heating in an oxidizing ambient atmosphere to form an oxide bond therebetween. Pressure may be applied between the ceramic parts to aid in bonding. A reliable bonded ceramic structure is thereby provided.
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Lasky, Wafer Bonding for Silicon-On-Insulator Technologies, Applied Physics Letters 48 (1), Jan. 6, 1986, pp. 78-80.
MCNC
Weston Caleb
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