Bonding of ceramic parts

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

264 56, 264 58, 428210, 428325, 428384, 428701, 428702, B32B 1800

Patent

active

050984942

ABSTRACT:
Ceramic parts may be bonded by forming bonding layers of silicon dioxide, silicon, metal or metal oxide on the parts, placing the bonding layers adjacent one another and heating in an oxidizing ambient atmosphere to form an oxide bond therebetween. Pressure may be applied between the ceramic parts to aid in bonding. A reliable bonded ceramic structure is thereby provided.

REFERENCES:
patent: 2437212 (1948-03-01), Schottland
patent: 3540957 (1970-11-01), Bawa et al.
patent: 3968057 (1976-07-01), Dulin
patent: 4224636 (1980-09-01), Yonezawa et al.
patent: 4293356 (1981-10-01), Ebata et al.
patent: 4352120 (1982-09-01), Kurihara et al.
patent: 4425407 (1984-01-01), Galasso et al.
patent: 4529459 (1985-07-01), Ebata et al.
patent: 4572841 (1986-02-01), Kaganowicz et al.
patent: 4602731 (1986-07-01), Dockus
patent: 4608326 (1986-08-01), Neukermans et al.
patent: 4613549 (1986-09-01), Tanakca
patent: 4689104 (1987-08-01), Lavendel et al.
patent: 4710428 (1987-12-01), Tamamizu et al.
patent: 4762269 (1988-08-01), Gyarmati et al.
patent: 4784313 (1988-11-01), Godziemba-Maliszewski
patent: 4789506 (1988-12-01), Kasprizyk
Lasky, Wafer Bonding for Silicon-On-Insulator Technologies, Applied Physics Letters 48 (1), Jan. 6, 1986, pp. 78-80.

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