Bonding of aligned conductive bumps on adjacent surfaces

Details Bonding of aligned conductive bumps on adjacent surfaces Bonding of aligned conductive bumps on adjacent surfaces

1987-09-16

1990-03-27

Hille, Rolf

Metal fusion bonding

Process

Critical work component, temperature, or pressure

228179, H01L 21447, H01L 21441, H01L 2144, H01L 2354

Patent

active

049125451

ABSTRACT:
A bump bonding process and product are disclosed in which both pressure and heating are used in situations where the temperature should not exceed a predetermined amount, e.g., bonding of a photoconductor array to a module containing electronic processing devices. The bonding process involves eutectic alloying of indium and bismuth, allowing welding of the bumps at a temperature substantially below the two metals' melting points. In one version of the invention, bumps on adjacent substrates are directly aligned. In another version, each bump on one substrate is wedged between a pair of bumps on the other substrate.

REFERENCES:
patent: 4376505 (1983-03-01), Wojcik
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4605153 (1986-08-01), Van Den Brekel et al.
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4749120 (1988-06-01), Hatada

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