Bonding methods for microchannel plates

Details Bonding methods for microchannel plates Bonding methods for microchannel plates

2006-04-04

2006-04-04

Kerns, Kevin (Department: 1725)

Metal fusion bonding

Process

Diffusion type

Reexamination Certificate

active

07021522

ABSTRACT:
Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).

REFERENCES:
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patent: 5514928 (1996-05-01), Niewold
patent: 5573173 (1996-11-01), van der Wilk et al.
patent: 6089444 (2000-07-01), Slattery et al.
patent: 6250541 (2001-06-01), Shangguan et al.
patent: 6521350 (2003-02-01), Fey et al.
patent: 6874674 (2005-04-01), Jacksen et al.
patent: 6938817 (2005-09-01), Saldana et al.

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