Bonding method using solder composed of multiple alternating gol

Details Bonding method using solder composed of multiple alternating gol Bonding method using solder composed of multiple alternating gol

1991-11-15

1993-03-30

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228123, 428647, H01L 2158

Patent

active

051976544

ABSTRACT:
A device such as a laser is bonded to a submount such as diamond by a process in which the submount is successively coated with an adhesion layer such as titanium, a barrier layer such as nickel, and a gold-tin solder-metallization composite layer formed by sequential deposition on the barrier layer a number (preferably greater than seven) of multiple alternating layers of gold and tin, the last layer being gold having a thickness that is equal to approximately one-half or less than the thickness of the (next-to-last) tin layer that it contacts immediately beneath it. The bonding is performed under applied heat that is sufficient to melt the solder-metallization composite layer. Prior to the bonding, (in addition to the submount) the device advantageously is coated with gold and optionally with a similar gold-tin solder-metallization composite layer, at least at locations where it comes in contact with the gold-tin solder-metallization composite layer.

REFERENCES:
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Wada, O. et al., "Preferential reaction and stability of the Au-Sn/Pt system: Metallization structure for flip-chip integration," Appl. Phys. Lett. 58 (9), Mar. 4, 1991, pp. 908-910.

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