Bonding method using photocurable acrylate adhesive containing p

Details Bonding method using photocurable acrylate adhesive containing p Bonding method using photocurable acrylate adhesive containing p

1987-04-13

1990-10-23

McCamish, Marion C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

4284256, 4284258, 522 13, 522 42, 522 96, C08F 250, C08F 434

Patent

active

049649388

ABSTRACT:
A reactive acrylic adhesive, activated by actinic radiation includes, in addition to a photoinitiator, at least about 1.0 percent by weight of a perester compound or cumene hydroperoxide, and 0.5 percent of a tautomeric organic acid, for enhanced bond strength.

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