Bonding method for semiconductor device manufacture

Details Bonding method for semiconductor device manufacture Bonding method for semiconductor device manufacture

1976-02-10

1976-12-14

Tupman, W.

Metal working

Method of mechanical manufacture

Electrical device making

29588, 357 80, B01J 1700

Patent

active

039966593

ABSTRACT:
An improved method of semiconductor device manufacture is provided in which the surfaces of glass sealed feed-through terminals are mechanically abraded to a uniform matte finish prior to plating and subsequent assembly. The mechanical abrasion, which in the preferred embodiment is performed by dry sand blasting, reduces the cost and improves the yield in subsequent assembly bonding steps and in particular substantially eliminates cold forming defects on the terminal nail head surface such that electrical conductors can be ultrasonically bonded thereto.

REFERENCES:
patent: 3089067 (1963-05-01), Baird
patent: 3153275 (1964-10-01), Ackerman
patent: 3259814 (1966-07-01), Green
patent: 3828425 (1974-08-01), Manus

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