Bonding method for semiconductor chips

Details Bonding method for semiconductor chips Bonding method for semiconductor chips

1995-12-12

1998-04-21

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228254, 438617, H01L 2160

Patent

active

057409560

ABSTRACT:
This invention is related to providing a bonding method for flip chips in which the circuit part is oriented to be face-down on a substrate after bonding bumps are formed on the semiconductor chip namely, forming Au bumps by Au wire ball bonding employing a wire ball bonding device onto aluminum bond pads of the semiconductor chips; coating the Au bumps with Sn/Pb alloy bumps also by wire ball bonding using a wire ball bonding device; with or without re-forming the Sn/Pb alloy bumps into a desired ball-shape by performing a heat treatment in a furnace after an activation solvent is applied to the Sn/Pb alloy bumps; and bonding (by the heat treatment in the furnace) the substrate to the coated bumps containing chip by a heat treatment in the furnace.

REFERENCES:
patent: 4674671 (1987-06-01), Fister et al.
patent: 4875618 (1989-10-01), Hasegawa et al.
patent: 5439162 (1995-08-01), George et al.
patent: 5497545 (1996-03-01), Watanabe et al.

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