Metal fusion bonding – Process – Diffusion type
Reexamination Certificate
2005-04-05
2005-04-05
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
Diffusion type
C348S217100, C348S777000
Reexamination Certificate
active
06874674
ABSTRACT:
Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).
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Iosue Michael J.
Jacksen Niels F.
Saldana Miguel M.
Tucker Jay Scott
Litton Systems Inc.
Marsteller & Associates, P.C.
Stoner Kiley S.
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