Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Uniting two separate solid materials
Patent
1995-08-18
1997-07-08
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Uniting two separate solid materials
205223, 437204, 437209, C25D 200
Patent
active
056457073
ABSTRACT:
In a bonding method for a chip-type electronic part, the electronic part is prefixed onto an element-mounting section of a wiring substrate by using a non-conductive adhesive agent while an external metal electrode of the electronic part is brought close to, or in contact with the metal wiring pattern formed on the wiring substrate. Then, the wiring substrate, on which the electronic part has been prefixed, is subjected to an electroplating process while it is immersed into plating liquid containing a metal component, so that the metal component, which is deposited on the metal wiring pattern, grows to form a metal layer, and the external metal electrode and the metal wiring pattern are thus electrically connected to each other through the metal layer. With this arrangement, since no short circuit occurs between the external metal electrodes or between the portions of the metal wiring pattern, it is possible to miniaturize the electronic part and also to narrow its packaging pitch, thereby achieving a high-density packaging. Further, no stress, such as caused by heat and pressure during the bonding process, is applied onto the wiring substrate and the chip-type electronic part. This makes it possible to remarkably improve the reliability of the apparatus.
REFERENCES:
patent: 5290423 (1994-03-01), Helber
patent: 5407864 (1995-04-01), Kim
patent: 5457149 (1995-10-01), Hall
George A. DiBari, "Nickel Plating", The Metal Finishing Handbook (Jan. 1987) pp. 240-262. Jan. 1987.
Mee Brendan
Niebling John
Sharp Kabushiki Kaisha
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