Bonding method for bumpless beam lead tape

Details Bonding method for bumpless beam lead tape Bonding method for bumpless beam lead tape

1988-12-01

1990-04-17

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using high frequency vibratory energy

228118, 2281802, H01L 2188

Patent

active

049172867

ABSTRACT:
A tape automated bonding method and structure is disclosed. Interconnection using prepatterned metal beam tape interconnect is accomplished by providing vias in passivation layers overlaying a metal region in or on the major surface of the device which is to receive the interconnect leads, eliminating the requirement for bonding pad bumps. Ultrasonic pressure is applied to the beams as they superpose the vias, bonding each lead to its respective metal region.

REFERENCES:
patent: 3698075 (1972-10-01), Boyle
patent: 3954217 (1976-05-01), Smith
IBM Technical Disclosure Bulletin, vol. 25, No. 4, Sep. 1982; See Edwards, pp. 1948-1949.

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