Bonding method employing polyamide oligomer-epoxy polymer adhesi

Details Bonding method employing polyamide oligomer-epoxy polymer adhesi Bonding method employing polyamide oligomer-epoxy polymer adhesi

1987-06-01

1989-04-11

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, 525423, 528113, 528123, B32B 3100

Patent

active

048203670

ABSTRACT:
Compositions for the preparation of thermosetting or thermoplastic polymers, which compositions comprise a mixture of at least one polyepoxide and at least one polyamide oligomer, wherein the oligomer is a primary monoamine, an alpha,omega-primary or -secondary diamine, an alpha,omega-diacid or an alpha-primary amine,omega-acid, together with process for preparing polymers and the uses of such materials for molding and for adhesives.

REFERENCES:
patent: 3183198 (1965-05-01), Wagner
patent: 3462337 (1969-08-01), Gorton
patent: 4500604 (1985-02-01), Herold et al.

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