Bonding method employing high performance induction curable two-

Details Bonding method employing high performance induction curable two- Bonding method employing high performance induction curable two-

1988-04-18

1989-11-07

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156330, 252 6254, 522 65, 522 71, 522170, 523137, 523458, B32B 3100

Patent

active

048789780

ABSTRACT:
An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of
(I) An epoxy resin component and
(II) A hardener component and
(III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.

REFERENCES:
patent: 3148082 (1964-09-01), Di Ricco et al.
patent: 3580776 (1971-05-01), Shenfil et al.
patent: 4578424 (1986-03-01), Goel
patent: 4762864 (1988-08-01), Goel et al.

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