Bonding method employing film adhesives containing an epoxide re

Details Bonding method employing film adhesives containing an epoxide re Bonding method employing film adhesives containing an epoxide re

1978-06-27

1980-08-19

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563069, 156330, 20415918, 427 53, 427 54, 428345, 428416, 428415, 430280, B29C 1902, C08F 818

Patent

active

042182794

ABSTRACT:
A layer of a liquid composition containing an epoxide resin as the sole photopolymerizable component, a heat-activated curing agent for epoxide resins, and preferably a photopolymerization catalyst, is exposed to actinic radiation until the layer solidifies to form an essentially solid, continuous film due to photopolymerization of the epoxide resin through epoxide groups, the resin remaining, however, still thermosettable by virtue of residual epoxide groups. The film so formed is sandwiched between, and in contact with, surfaces to be bonded together, and the assembly is heated to cure the epoxide resin.

REFERENCES:
patent: 3205157 (1965-09-01), Licari et al.
patent: 3625744 (1971-12-01), Juna et al.
patent: 3708296 (1973-01-01), Schlesinger
patent: 3929545 (1975-12-01), van Dyck et al.
patent: 4058401 (1977-11-01), Crivello
patent: 4069055 (1978-01-01), Crivello
patent: 4072592 (1978-02-01), Due et al.
patent: 4076869 (1978-02-01), Flynn
patent: 4107353 (1978-08-01), Karoly et al.
Lee, H. & Neville, K., "Handbook of Epoxy Resins," .COPYRGT.1967, pp. 5-18.

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