Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Reexamination Certificate
2006-01-31
2006-01-31
Haran, John T. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
C156S379800, C156S381000, C029S740000
Reexamination Certificate
active
06991703
ABSTRACT:
A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.
REFERENCES:
patent: 2001/0050143 (2001-12-01), Crocker
patent: 2003/0150563 (2003-08-01), Kuibara et al.
patent: 2003/0178474 (2003-09-01), Jiang et al.
patent: 62-296433 (1987-12-01), None
patent: 64-061923 (1989-03-01), None
patent: 11340614 (1999-10-01), None
patent: 2000-138255 (2000-05-01), None
patent: 2001 308114 (2001-02-01), None
patent: 2002-297880 (2003-10-01), None
patent: 2003-318217 (2003-11-01), None
English translation of Abstract for Japanese Patent application No. 64-061923.
English translation of Abstract for Japanese Patent application No. JP 11340614.
English translation of Abstract for Japanese Patent application No. JP 2001 308114.
Office Action issued by Japanese Patent Office on Jan. 11, 2005 in connection with corresponding Japasene application No. 2002-281071.
English translation of Japanese Office Action dated Jan. 11, 2005.
Kosakai Mamoru
Ootsuka Takeshi
Haran John T.
Ostrolenk Faber Gerb & Soffen, LLP
Sumitomo Osaka Cement Co. Ltd.
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