Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-04-24
2007-04-24
Desire, Gregory (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C156S351000, C156S358000, C228S103000, C324S765010, C382S218000, C382S294000
Reexamination Certificate
active
10959242
ABSTRACT:
With an assumption that the three data of the position (X1, Y1) of the first positioning pattern202and position (X2, Y2) of the second positioning pattern212of the reference chip200, and the position (X3, Y3) of the first positioning pattern232of the bonding object chip230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle θ2of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range250that is to be imaged next is determined by detecting the inclination-angle Δθ of the first positioning pattern232of the bonding object chip230. Furthermore, the imaging range can be narrowed and the second positioning pattern252can be captured by increasing the precision of Δθ.
REFERENCES:
patent: 5199628 (1993-04-01), Homma
patent: 5498767 (1996-03-01), Huddleston et al.
patent: 5521987 (1996-05-01), Masaki
patent: 5621218 (1997-04-01), Tanaka
patent: 5780866 (1998-07-01), Yamamura et al.
patent: 6014965 (2000-01-01), Nishida
patent: 6064194 (2000-05-01), Farnworth et al.
patent: 6193132 (2001-02-01), Shibata et al.
patent: 6814121 (2004-11-01), Hayata et al.
patent: 6868176 (2005-03-01), Sugawara
patent: 6961457 (2005-11-01), Sugawara
patent: 7013039 (2006-03-01), Sugawara
patent: 7044182 (2006-05-01), Haraguchi
patent: 7142725 (2006-11-01), Komiya et al.
patent: 2005/0167471 (2005-08-01), Sugawara
patent: 63-56764 (1988-03-01), None
patent: 2864735 (1999-03-01), None
patent: 2002-208010 (2002-07-01), None
Enokido Satoshi
Sugawara Kenji
Desire Gregory
Kabushiki Kaisha Shinkawa
Koda & Androlia
LandOfFree
Bonding method, bonding apparatus and bonding program does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bonding method, bonding apparatus and bonding program, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding method, bonding apparatus and bonding program will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3774598