Bonding method and method of manufacturing a display device

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S272200, C156S275500

Reexamination Certificate

active

07927440

ABSTRACT:
Air bubbles or foreign objects in a transparent adhesive layer that bonds a transparent plate and a plate-like member together in full-surface contact are detected without fail. For the detection, an optical fiber or the like is used to irradiate the adhesive layer with light from a side, the cast light is guided through the adhesive layer, and a state of the adhesive layer is checked with the guided light. A check that discriminates defects in the adhesive layer from defects in the bonded transparent plate is thus made possible.

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patent: 2004325788 (2004-11-01), None
JP 2002-139455—Machine Translation. May 2002.
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Patent Abstracts of Japan, publication No. JP6082778, publication date Mar. 25, 1994.
Patent Abstracts of Japan, publication No. JP11287937, publication date Oct. 19, 1999.
Patent Abstracts of Japan, publication No. JP2002139455, publication date May 17, 2002.
Patent Abstracts of Japan, publication No. JP2004325788, publication date Nov. 18, 2004.
Patent Abstracts of Japan, publication No. 2002-139455, publication date May 17, 2002.

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