Bonding method and bonding apparatus

Details Bonding method and bonding apparatus Bonding method and bonding apparatus

2005-08-23

2005-08-23

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

C228S004500

Reexamination Certificate

active

06932262

ABSTRACT:
Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship ofin-line-formulae description="In-line Formulae" end="lead"?(vibration-axial directional holding force)>(die shear strength)+(inertial force)in-line-formulae description="In-line Formulae" end="tail"?while applying an ultrasonic vibration to a region which is subjected to bonding.

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patent: 5921460 (1999-07-01), Topping et al.
patent: 6010059 (2000-01-01), Newland
patent: 6609648 (2003-08-01), Kondo
patent: 6662992 (2003-12-01), Betrabet et al.
patent: 2002-164384 (2002-06-01), None

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