Bonding method and bonding apparatus

Metal fusion bonding – Process – Using high frequency vibratory energy

Reexamination Certificate

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Details

C228S113000, C156S064000, C156S358000, C156S580200, C310S323180, C700S301000

Reexamination Certificate

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07370786

ABSTRACT:
Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship ofin-line-formulae description="In-line Formulae" end="lead"?(vibration-axial directional holding force)>(die shear strength)+(inertial force)in-line-formulae description="In-line Formulae" end="tail"?while applying an ultrasonic vibration to a region which is subjected to bonding.

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patent: 2002-164384 (2002-06-01), None

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