Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
2008-05-13
2008-05-13
Yao, Sam Chuan C. (Department: 4111)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S113000, C156S064000, C156S358000, C156S580200, C310S323180, C700S301000
Reexamination Certificate
active
07370786
ABSTRACT:
Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship ofin-line-formulae description="In-line Formulae" end="lead"?(vibration-axial directional holding force)>(die shear strength)+(inertial force)in-line-formulae description="In-line Formulae" end="tail"?while applying an ultrasonic vibration to a region which is subjected to bonding.
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Inomata Teruji
Kurita Yoichiro
Maeda Masato
Nogawa Jun
Barry Erin P
NEC Electronics Corporation
Sughrue & Mion, PLLC
Yao Sam Chuan C.
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