Bonding method and bonding apparatus

Details Bonding method and bonding apparatus Bonding method and bonding apparatus

1993-03-30

1994-04-26

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228102, 2282341, H05K 334

Patent

active

053059441

ABSTRACT:
A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.

REFERENCES:
patent: 4364508 (1982-12-01), Lazzery et al.
patent: 5017170 (1991-05-01), Daugherty et al.
IBM Technical Disclosure, "Direct Chip Attach to Flex Substrates", vol. 34, No. 11, pp. 362, 363, Apr. 1992.

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