Bonding method and bonding apparatus

Details Bonding method and bonding apparatus Bonding method and bonding apparatus

1989-09-28

1991-03-26

Heinrich, Sam

Metal fusion bonding

Process

Using high frequency vibratory energy

228111, 228 11, 219 5621, 219 5622, 219 8518, B23K 300, H01L 21607

Patent

active

050022172

ABSTRACT:
A bonding method and apparatus for bonding a wire material having a ball-like end on a bonding pad is disclosed. While the ball of the wire material on the bonding pad is being pressed by a bonding tip, an ultrasonic wave and a high frequency current are applied in combination to the bonding tip so as to improve strength of the bonding portion.

REFERENCES:
patent: 3481839 (1969-12-01), Inoue
patent: 3747198 (1973-07-01), Benson et al.
patent: 3934108 (1976-01-01), Howard
patent: 4315128 (1982-02-01), Matcovich et al.
patent: 4674671 (1987-06-01), Fister et al.
patent: 4821944 (1989-04-01), Tsumura
Modern Metals, "Soldering Aluminum with Sound Waves", p. 36, Jul. 1948.
Electronics, "Ultrasonic Iron Solders Aluminum", Oct. 1, 1977.
Electronic Equipment News, "Ultrasonic Assembly to Electronics", vol. 12, No. 8, pp. 36-42, Nov. 1970.

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