Bonding method and apparatus therefor

Details Bonding method and apparatus therefor Bonding method and apparatus therefor

1991-12-02

1993-07-06

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With testing, measuring, and/or indicating means

156 64, 29721, 29833, 29834, 356400, G01D 528

Patent

active

052250261

ABSTRACT:
Two parts to be bonded together, such as a circuit board and a chip, are brought into one-above-the-other relationship, and before bonding is performed, a detecting device with an upper opening and a lower opening is set between the two parts, and by the use of optical system that is lights which passes through the openings, a positional alignment between the two parts is performed by correcting any discrepancy between the two so that the two parts are properly set one on the other and accurate bonding is executed to the two parts.

REFERENCES:
patent: 4668095 (1987-05-01), Maeda
patent: 5044072 (1991-09-01), Blais et al.
patent: 5133603 (1992-07-01), Suzuki et al.
Gaston, IBM Technical Disclosure Bulletin, vol. 25, No. 5, Oct. 1982.

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