Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-12-05
2006-12-05
Fischer, Justin R. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S275500, C156S275700, C156S282000, C156S311000, C156S321000, C219S385000, C219S678000, C219S681000, C349S187000, C438S118000, C438S119000
Reexamination Certificate
active
07144471
ABSTRACT:
A bonding method and apparatus for performing same in which a first member (e.g., a silicon chip) is bonded to a second member (e.g., a glass substrate such as a PCB) using a thermosetting resin adhesive. Near infrared rays are directed onto the second member, some of these passing through the second member to also heat the adhesive. A heater is pressed onto the first member and also heats the first member. Selective cooling is also utilized to assure an acceptable temperature gradient between both members and thereby prevent distortion of same which could harm the resulting structure.
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Hanada Masaki
Kobayashi Shigetaka
Yamada Takeshi
Fischer Justin R.
Fraley Lawrence R.
Samodovitz Arthur J.
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