Bonding method and apparatus

Details Bonding method and apparatus Bonding method and apparatus

1988-05-23

1989-01-03

Godici, Nicholas P.

Metal fusion bonding

Process

Using a compliant cushioning medium

228 55, 2281802, 228239, B23K 3100

Patent

active

047950773

ABSTRACT:
A method for bonding which comprises the step of heating a bottom thermode to a temperature of approximately 150.degree. C. The bottom thermode is then pulse heated to approximately 350.degree. C. while a die and lead frame are disposed above the lower thermode. An upper thermode, which may remain unheated, is then lowered to cause contact between the lead frame and the contacts of the die. The lower thermode then returns to a temperature of approximately 150.degree. C. The pulse heating of the lower thermode lasts for approximately 1-3 seconds.

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patent: 4607779 (1986-08-01), Burns
patent: 4657170 (1987-08-01), Miller

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