Bonding method and apparatus

Details Bonding method and apparatus Bonding method and apparatus

1993-06-28

1996-03-19

Paschall, Mark H.

Electric heating

Metal heating

By arc

21912164, 21912183, B23K 2600

Patent

active

055005020

ABSTRACT:
An apparatus for bonding lead terminals to bumps of a semiconductor chip by using a laser beam. On the basis of a temperature signal obtained from irradiation of a lead terminal and a bump to be bonded together under irradiation of the laser beam, state of contact and the bond between the bump and the lead terminal are decided. The bonding between the terminals and the bumps can be realized without fail by checking the state of contact therebetween in precedence to the bonding operation.

REFERENCES:
patent: 4696104 (1987-09-01), Vanzetti et al.
patent: 4845335 (1989-07-01), Andrews et al.
patent: 5196672 (1993-03-01), Matsuyama et al.
patent: 5283416 (1994-02-01), Shirk
Jafari, S. u. a., Dusseldorf, 1993.

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