Metal fusion bonding – Process – Plural joints
Patent
1986-04-28
1988-05-31
Jordan, M.
Metal fusion bonding
Process
Plural joints
228 37, 228264, B23K 300
Patent
active
047475331
ABSTRACT:
An apparatus for reflowing solder terminals that join an electronic element to a support substrate, which apparatus includes (1) a stage for supporting the substrate, (2) a quantity of liquid capable of being heated to a temperature in excess of the melting point of the solder of the solder terminals, (3) a means to contact a surface of the substrate with the liquid, including a reservoir for maintaining the liquid, and a pumping means to move the liquid from the reservoir into contact with the surface of the substrate, and (4) a means to control the temperature of the liquid when in contact with the substrate to initially increase the temperature of the liquid, and subsequently reduce the temperature of the liquid.
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Apparatus for Small Vertical Movement, by Hamilton and Karcher, vol. 11 No. 10, p. 1334 Mar. 1969, IBM Bulletin.
Nozzle for Flow Soldering Machines, by Pringel, vol. 2, No. 2, p. 25, Aug. 1959, IBM Bulletin.
Rework Apparatus for Multipin Array Modules, by Steenstrup, vol. 17, No. 1, p. 56, Jun. 1974, IBM Bulletin.
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Method for Rosin-Oil Soldering by Babuka and Poliak, vol. 12, No. 8, p. 1209, Jan. 1970, IBM Bulletin.
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Blecker Ira David
International Business Machines - Corporation
Jordan M.
Stoffel Wolmar J.
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