Bonding method and apparatus

Details Bonding method and apparatus Bonding method and apparatus

1976-05-14

1978-07-04

Kelly, Donald G.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

219 68, 219 861, 228111, 219 7613, B23K 3704, H01L 2160

Patent

active

040984478

ABSTRACT:
Difficulties in forming a ball on the end of a wire of aluminium or aluminium alloy for ball bonding are overcome by applying between the wire and an electrode a low voltage, typically 30 volts, and bringing the wire and electrode into temporary contact to fuse the wire and initiate a spark discharge which results in the formation of a ball on the wire end. The spark discharge takes place in a shielding gas to avoid oxidation of the ball.

REFERENCES:
patent: 2679570 (1954-05-01), Cisne
patent: 3934108 (1976-01-01), Howard
patent: 3950631 (1976-04-01), Schmidt et al.
Baker and Bryan, "An Improved Form of Thermocompression Bond," British Journal Applied Physics, 1965, vol. 16, pp. 865-868.

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