Bonding method

Details Bonding method Bonding method

2005-03-22

2005-03-22

Fiorilla, Chris (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S299000, C156S300000, C029S832000, C029S833000, C029S834000, C029S734000

Reexamination Certificate

active

06869491

ABSTRACT:
In a bonding method in which two display panels7A,7B are held by the two panel holding portions31a, 31bprovided on the panel support table31positioned by the XYθ table30so as to position the first pressure bonding head25A and the second pressure bonding head25B for conducting pressure bonding individually, according to the result of positional detection of the camera37and the recognizing portion65, the display panel7A is positioned to the first pressure bonding head and an object of pressure bonding is bonded by pressure. In this pressure bonding step, under the condition that a state of holding the display panel7A is released, the display panel7B is positioned to the second pressure bonding head25B.

REFERENCES:
patent: 20010032030 (2001-10-01), Nakahara et al.
patent: 20020004980 (2002-01-01), Onitsuka
patent: 2003-59975 (2003-02-01), None

Affiliated with

Also associated with

Rating

Bonding method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3449046