Fishing – trapping – and vermin destroying
Patent
1988-05-03
1989-10-24
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437183, 437247, 228188, H01L 2160
Patent
active
048762210
ABSTRACT:
Disclosed is a method for bonding one of the principal planes of a lead formed on a film or the like and an electrode formed on the face side of a semiconductor element, by way of metal bumps, wherein the electrode, metal bumps and lead are pressurized between a support for supporting the semiconductor element and a jig placed at the other principal plane side of the lead, and the semiconductor element is heated so that the temperature at the back side of the semiconductor element may be higher than that at the face side of the semiconductor element. According to this method, it is enough to heat the support at the semiconductor element side, and it is not necessary, as required in the prior art, to heat temperature, and the conventional problems such as fusion of lead to the boding tool are solved. Still more, since the bonding tool can be placed at the back side of the semiconductor element and the bonding tool contacts only with the back side of the element, so that fusion of lead to the bonding tool and lowering of thermal conduction to the tool bottom may be also prevented.
REFERENCES:
patent: 4247590 (1981-01-01), Hayakawa et al.
patent: 4494688 (1985-01-01), Hatada et al.
Hearn Brian E.
Matsushita Electric - Industrial Co., Ltd.
Nguyen Tuan
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