Bonding method

Details Bonding method Bonding method

1988-03-07

1989-02-21

Jordan, M.

Metal fusion bonding

Process

Plural joints

B23K 3102

Patent

active

048058319

ABSTRACT:
A method of reflowing solder terminals that join an electronic device to a substrate. The method includes the steps of contacting the bottom surface of the substrate with a liquid and then controlling the temperature of the liquid when in contact with the substrate so that the temperature of the liquid in contact with the substrate is varied. The latter step involves rapidly increasing the temperature of the liquid from a temperature below the melting point of the solder to a temperature exceeding the melting point of the solder and then rapidly decreasing the temperature of the liquid to a temperature below the melting point of the solder.

REFERENCES:
patent: 4032033 (1977-06-01), Chu et al.
patent: 4274576 (1981-06-01), Shariff
patent: 4332342 (1982-06-01), Van Derput
patent: 4401253 (1983-08-01), O'Rourke
patent: 4402448 (1983-09-01), O'Rourke
patent: 4580216 (1986-04-01), Barresi et al.
patent: 4600137 (1986-07-01), Comerford
patent: 4676069 (1987-06-01), Miyake

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