Bonding method

Details Bonding method Bonding method

1990-02-01

1991-06-04

Heinrich, Sam

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, H01L 2158, B23K10136

Patent

active

050207156

ABSTRACT:
A bonding method including the steps of dividing a substrate into a plurality of regions along its length, storing substrate feeding data and bonding pattern data for the respective regions into a data memory, feeding the substrate underneath a bonding tool in accordance with the substrate feeding data, and then successively performing bonding for the respective regions in accordance with the bonding pattern data.

REFERENCES:
patent: 3581375 (1971-06-01), Rottmann
patent: 4479298 (1984-10-01), Hug
patent: 4501064 (1985-02-01), DiNozzi et al.
patent: 4763827 (1988-08-01), Watanabe et al.

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