Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1983-02-28
1984-06-12
Kimlin, Edward C.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1563069, 1563244, 156332, 4272082, C09J 500, C09J 700, B05D 510, B65C 925
Patent
active
044539975
ABSTRACT:
A method for bonding which comprises: interposing between the articles to be bonded at least one of which has an aqueous moisture content in a normal condition of at least about 1% by weight based on the weight of the article, a moisture curable adhesive material and then heating the assembly under pressure to supply water vapor from the moisture-containing article to cure the adhesive material, wherein said adhesive material comprises a sheet, film or tape of a thermofusible adhesive resin and/or rubber containing about 0.1 to 20% by weight based on the weight of the resin and/or rubber of a carboxyl group and not more than about 0.5% by weight free water and uniformly dispersed therein, a powder of an oxide of a metal of Group IIa of Mendeleev's Periodic Table having an average particle diameter of about 0.1 to 1,000.mu..
REFERENCES:
patent: 3725115 (1973-04-01), Christenson et al.
patent: 3960638 (1976-06-01), Ogata et al.
patent: 4092202 (1978-05-01), Bergk et al.
patent: 4218280 (1980-08-01), Philipp et al.
patent: 4243462 (1981-01-01), Hori et al.
Hori Yutaka
Satsuma Michio
Sunakawa Makoto
Falasco L.
Kimlin Edward C.
Nitto Electric Industrial Co. Ltd.
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